INTRODUCTION

Wire bonding is a method of creating connections (ATJs) between an integrated circuit (IC) or other semiconductor device and its enclosure during semiconductor device fabrication. Although not common, wire bonding can be used to connect an IC to other electronic devices or to connect from one printed circuit board (PCB) to another. Wire bonding inspection is very important in the manufacturing process. AVA has developed high-precision measurement and inspection algorithms.

Wire defects that can be inspected: missing wires, broken wires, misaligned wires, shorted wires

Wire bonding inspection results:

AVA's algorithm measures and checks dimensions at the joints.

Stitch Check Algorithm

Ball/Pad check algorithm